Thermal and Energy Efficient RAM Design on 28nm for Electronic Devices
نویسندگان
چکیده
منابع مشابه
Energy-Efficient SRAM Design in 28nm FDSOI
As CMOS scaling continues to sub-32nm regime, the effects of device variations become more prominent. This is very critical in SRAMs, which use very small transistor dimensions to achieve high memory density. The conventional 6T SRAM bit-cell, which provides the smallest cell-area, fails to operate at lower supply voltages (Vdd). This is due to the significant degradation of functional margins ...
متن کاملsimulation and design of electronic processing circuit for restaurants e-procurement system
the poor orientation of the restaurants toward the information technology has yet many unsolved issues in regards to the customers. one of these problems which lead the appeal list of later, and have a negative impact on the prestige of the restaurant is the case when the later does not respond on time to the customers’ needs, and which causes their dissatisfaction. this issue is really sensiti...
15 صفحه اولTowards Energy Efficient Parallel Computing on Consumer Electronic Devices
In the last two decades supercomputers have sustained a remarkable growth in performance that even out-performed the predictions of Moore’s law, primarily due to increased levels of parallelism [19]. As industry and academia try to come up with viable approaches for exascale systems, attention turns to energy efficiency as the primary design consideration. At the same time, energy efficiency ha...
متن کاملHSTL IO Standard Based Energy Efficient Multiplier Design using Nikhilam Navatashcaramam Dashatah on 28nm FPGA
In this paper we have designed an energy efficient multiplier using Nikhilam Navatashcaramam Dashatah Vedic technique. Vedic mathematics consists of 16 sutras and these sutras were used by our ancient scholars for doing there calculation faster, when there were no computers and calculators. Nikhilam Navatasaman is a Sanskrit word which menas “all from 9 and the last from 10”. In today’s work th...
متن کاملThermal Design of Power Electronic Devices and Modules
This work describes a way to apply 3D Finite Element (FE) analysis to the thermal design of power electronic modules using simplified geometry models of the system components. The method here presented can overcome the problem of solving equation systems with a very high number of Degrees Of Freedom (DOF) due to complex geometry of a power module.
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Indian Journal of Science and Technology
سال: 2016
ISSN: 0974-5645,0974-6846
DOI: 10.17485/ijst/2016/v9i21/94832